[robotics-worldwide] Special Issue on Equipment & Operations Automation in the Semiconductor Industry: IEEE Robotics and Automation Society TASE

James Morrison james.morrison at kaist.edu
Sun Mar 15 20:06:41 PDT 2009

 Dear Colleagues,

The IEEE Robotics and Automation Society has approved a special issue of the
IEEE Transactions on Automation Science and Engineering (IEEE TASE)! The
issue focuses on Equipment and Operations Automation in the Semiconductor
Industry and is scheduled for publication mid 2010.

Example topics of interest include the scheduling of wafer handling robots
to optimize cluster tool throughput, design of equipment and robot
structure, factory modeling, decision support systems and the control of
robotics for system and/or equipment productivity. Papers addressing topics
from the theory and application of robotics and automation in the
semiconductor industry are welcome. A more extensive list containing topics
of interest is provided below.

Important dates follow:
-         June 1, 2009: PAPER SUBMISSION DEADLINE.

-         September 15, 2009: Completion of the first round paper review.

-         January 1, 2010: Completion of the second round paper review.

-         March 1, 2010: Final manuscripts due.

-         July 1, 2010: Tentative publication date.

The CFP is available at http://xs3d.kaist.edu/TC-SMA. We welcome high
quality papers from both industry and academia.

Topics of interest include but are not limited to the following:
-         Decision technologies for equipment automation (e.g., scheduling
of wafer handling robots)
-         Design concepts for equipment and related automation  (e.g.,
equipment and wafer handling robot structure)
-         Design for manufacturing (DFM)
-         Factory modeling, analysis and performance evaluation
-         Algorithms for planning, scheduling and coordination
-         Wafer release and dispatch policies
-         Equipment productivity improvement
-         Automated material handling systems (AMHS)
-         Factory/cell/equipment-level controller design
-         Manufacturing execution systems (MES)
-         Advanced process control (APC)
-         Decision support systems (DSS)
-         Yield enhancement systems and e-Diagnosis
-         Data mining for yield and production improvement
-         Equipment engineering systems (EES)
-         Fully automated factory and remote operation center
-         Mobile and wireless applications (RFID)
-         Agent based intelligent systems
-         Engineering chains and supply chains
-         Factory of the future
-         Benchmark and case studies
-         Automation in 300mm prime/450mm wafer generations (e.g., issues in
robotics for future wafer size generations)

I look forward to your contribution!

Best regards,

James R. Morrison, Ph.D.
Assistant Professor, Department of Industrial and Systems Engineering,
KAIST, South Korea
Co-chair of the IEEE Robotics and Automation Society Technical Committee on
Semiconductor Manufacturing Automation
E-mail: james.morrison at kaist.edu, TEL: +82-42-350-3127
xS3D Lab homepage: http://xs3d.kaist.edu
IEEE Technical Committee on Semiconductor Manufacturing Automation:

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