[robotics-worldwide] Call for paper IEEE T-ASE - Special issue on Micro-Assembly for manufacturing at small scales

Philippe Lutz philippe.lutz at femto-st.fr
Fri Dec 9 00:16:45 PST 2011

Call for Papers:
Journal IEEE Tansactions on Automation Science and Engineering

Special Issue:
Micro-Assembly for manufacturing at small scales 

The design and fabrication of innovative and complex microsystems offer 
extremely promising solutions in the tremendous objective of 
miniaturized products miniaturization. Within this scope, 
micro-assembly, i.e. the 3D integration of hybrid chips (from few µm to 
few hundreds of µm in size) together, is a powerful approach to produce 
complex and heterogeneous products. Developments enabled lots of proof 
of concepts (actuators, sensors, gripping principles and tools, control, 
manipulation....) but assemblies performed automatically and/or with 
acceptable yields are, at the same time, extremely recent and 
challenging topics. It notably requires to simultaneously consider 
microfabrication tolerances (M(O)EMS components to assemble, handling 
tools...), robots uncertainties, sensors integration, reliable control, 
bonding and metrology aspects, all of these aspects being specific at 
the microscale (lack of sensors and adapted gripping tools, small signal 
to noise ratio, use of non linear actuators, surface force predominance...)
The aim of this special issue is to provide most recent and original 
results on innovative micro-assembly methods and technologies with a 
special focus on processes going beyond of proof of concepts. It is also 
highlight current challenging topics and the main outlooks will not only 
be from a scientific point of view but also from an application one.

Topics to be covered include, but are not limited to:

Robotic Micro-Assembly
Self-Assembly Techniques
Hybrid Micro-Assembly
Force and/or Position (including vision) based Automated Micro-Assembly
Open-Loop Automated Micro-Assembly
Packaging of M(O)EMS
Novel Control Tools for Micro-Assembly Systems
Joining of Microscale Components
Assembled M(O)EMS Products
Calibration of Micro-Assembly Platforms
Metrology for M(O)EMS Characterization
Sensor Fusion for Micro-Assembly

Paper submission:

ASAP: Contact guest editor (title + abstract)

March 15, 2012: Paper submission deadline.

July 15, 2012: Completion of the first round review

October 15, 2012: Completion of the second round review

December 15, 2012: Final manuscripts due.

May 2013: Tentative publication date.

All papers are to be submitted through the IEEE's *Manuscript Central* 
for Transactions on Automation Science and Engineering 
http://mc.manuscriptcentral.com/t-ase.Please select "Special Issue" 
under Manuscript Category of your submission. All manuscripts must be 
prepared according to the IEEE Transactions on Automation Science and 
Engineering publication guidelines 
http://www.ieee-ras.org/tase/forauthors Please address all inquiries to 
plutz at femto-st.fr <mailto:plutz at femto-st.fr>

Guest Editors

Karl F. Böhringer (University of Washington, USA)

Philippe Lutz (Femto-st Institute, France)

Cédric Clévy (Femto-st Institute, France)

Dan O. Popa (University of Texas at Arlington, USA)

Quan Zhou (Aalto University, Finland)

Philippe Lutz
Professeur des Universit?s, Universit? de Franche Comt? (http://www.univ-fcomte.fr)
Directeur de l'Ecole Doctorale SPIM
24 rue Alain Savary, F - 25000 Besan?on

Full Professor
Director of the PhD graduate School (Doctorale School) of Engineering Science

Direct phone: (33) 0 381 402 785
Portable: (33) 0 670 218 094
Fax: (33) 0 381 402 809
E-mail: philippe.lutz at femto-st.fr

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